This past year, MediaTek announced that it was temporarily giving up on the high-end smartphone chipset industry. A lack of attention from customers and the comparatively lower performance of these chips was a factor in that choice.
The business has since focused its energies on the mid-range and lower-end of this market, resulting in chips like the upcoming Helio P40 and P70. Both these processors are expected to debut in Mobile World Congress 2018 (MWC 2018) next month.
The P40 and P70 are comparatively high-end chips, according to the likes of Qualcomm’s 600 and 800 series chips. Details of another processor known as the Helio P38 also have leaked out today, and based on a Chinese news site, is expected to compete from the Snapdragon 630 lineup of high-end chips from Qualcomm.
The P38, P40 and P70 appear to be using largely the exact same architecture. Judging from the leaks, they all contain an 8-core CPU which uses 4x ARM Cortex A73 cores and 4x ARM Cortex A53 cores at varying clock-speeds. Do note that flagship chipsets like the Exynos chips powering Samsung’s Galaxy S8 and the Qualcomm ones in the Pixel 2 utilize the same cores. Additionally, the new P series Helio chips are reportedly built on a 12 nm, which can be fractionally less power efficient compared to 10 nm procedure that Qualcomm and Samsung are quickly shifting to.
In MediaTek’s case, these cores are operating at much lower speeds than in their flagships. The SD845 sees the chips hitting 2.45 GHz, in the instance of the P38, the CPU is clocked to 1.8 GHz, which will be about 30% slower. The P40 and P70 are clocked at 2.0 GHz and 2.5 GHz respectively. The graphics unit is also underclocked slightly.
Based on GizmoChina, it is expected that the lower clock-speed will provide the P38 an advantage in tasks like gaming as it will run cooler and thus, have the ability to keep up its performance for longer.
Expect to observe all these chips, and maybe even phones toting these chips, at MWC this year.